The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2011

Filed:

Jan. 21, 2009
Applicants:

Moriyuki Kashiwa, Annaka, JP;

Etsuo Fujita, Annaka, JP;

Kazuo Kobayashi, Annaka, JP;

Tomio Kubo, Annaka, JP;

Inventors:

Moriyuki Kashiwa, Annaka, JP;

Etsuo Fujita, Annaka, JP;

Kazuo Kobayashi, Annaka, JP;

Tomio Kubo, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening platealso is a load on the grindstonethat does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.


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