The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jun. 05, 2008
Katsumi Shibayama, Hamamatsu, JP;
Helmut Teichmann, Zurich, CH;
Takafumi Yokino, Hamamatsu, JP;
Tomofumi Suzuki, Hamamatsu, JP;
Dietmar Hiller, Zurich, CH;
Ulrich Starker, Zurich, CH;
Katsumi Shibayama, Hamamatsu, JP;
Helmut Teichmann, Zurich, CH;
Takafumi Yokino, Hamamatsu, JP;
Tomofumi Suzuki, Hamamatsu, JP;
Dietmar Hiller, Zurich, CH;
Ulrich Starker, Zurich, CH;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
Since a spectroscopic module () has a plate-shaped body section (), the spectroscopic module can be reduced in size by reducing the thickness of the body section (). Moreover, since the body section () is plate-shaped, the spectroscopic module () can be manufactured, for example, by using a wafer process. More specifically, by providing lens sections (), diffraction layers (), reflection layers () and light detecting elements () in a matrix form on a glass wafer which becomes many body sections () and dicing the glass wafer, many spectroscopic modules () can be manufactured. This enables easy mass production of spectroscopic modules ().