The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Oct. 26, 2007
Takeshi Kitahara, Toyota, JP;
Hiroya Ishizuka, Koshigaya, JP;
Yoshirou Kuromitsu, Saitama, JP;
Tomoyuki Watanabe, Toyota, JP;
Takeshi Kitahara, Toyota, JP;
Hiroya Ishizuka, Koshigaya, JP;
Yoshirou Kuromitsu, Saitama, JP;
Tomoyuki Watanabe, Toyota, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Abstract
Disclosed is a power module having improved joint reliability. Specifically disclosed is a power module including a power module substrate wherein a circuit layer is brazed on the front surface of a ceramic substrate, a metal layer is brazed on the rear surface of the ceramic substrate and a semiconductor chip is soldered to the circuit layer. The metal layer is composed of an Al alloy having an average purity of not less than 98.0 wt. % but not more than 99.9 wt. % as a whole. In this metal layer, the Fe concentration in the side of a surface brazed with the ceramic substrate is set at less than 0.1 wt. %, and the Fe concentration in the side of a surface opposite to the brazed surface is set at not less than 0.1 wt. %.