The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jul. 14, 2009
Seung-woo Shin, Suwon-si, KR;
Byung-lyul Park, Seoul, KR;
Jong-myeong Lee, Seongnam-si, KR;
Gil-heyun Choi, Seoul, KR;
Jong-ho Yun, Suwon-si, KR;
Seung-woo Shin, Suwon-si, KR;
Byung-lyul Park, Seoul, KR;
Jong-myeong Lee, Seongnam-si, KR;
Gil-heyun Choi, Seoul, KR;
Jong-ho Yun, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Abstract
Provided is a semiconductor device including a fuse, in which a insulating layer surrounding the fuse or metal wiring is prevented from being damaged due to the cut of a fuse, which can occur when a repair process is performed. The semiconductor device includes a conductive line formed on a semiconductor layer, a protective layer formed on the conductive line, one or more fuses that are electrically connected to the conductive line, and a fuse protective layer formed on the one or more fuses, and spaced apart from the protective layer.