The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8043533 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 25, 2011

Filed:

Oct. 26, 2007
Applicants:

Itsuro Tajima, Naka, JP;

Akhmadi Eko Wardoyo, Naka, JP;

Osamu Fukunaga, Ichikawa, JP;

Inventors:

Itsuro Tajima, Naka, JP;

Akhmadi Eko Wardoyo, Naka, JP;

Osamu Fukunaga, Ichikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/04 (2006.01); H11B 1/06 (2006.01); B01J 3/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is to provide a diamond sintered compact having good conductivity together with the characteristics, such as hardness, thermal conductivity, thermal resistance, chemical stability, almost equal to those of a natural diamond. A boron-doped diamond sintered compact having good conductivity and high thermal resistance is produced by a sintering process, in which 90 to 99.9 wt. % of a boron-doped diamond powder and 0.1 to 10% wt. % of a powder comprising, one or more of carbonates including Mg, Ca, Sr or Ba, and/or one or more of composite carbonates composed by two or more of these elements, as a bonding phase component, are sintered together under Ht/HP conditions, and the bonding phase component melts and then fills into the space between the boron-doped diamond powder particles.


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