The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Aug. 02, 2007
Ralph Herber, Berlin, DE;
Olaf Kurtz, Berlin, DE;
Johannes Etzkorn, Berlin, DE;
Christian Madry, Berlin, DE;
Carsten Schwiekendick, Berlin, DE;
Gerd Schafer, Berlin, DE;
Ralph Herber, Berlin, DE;
Olaf Kurtz, Berlin, DE;
Johannes Etzkorn, Berlin, DE;
Christian Madry, Berlin, DE;
Carsten Schwiekendick, Berlin, DE;
Gerd Schafer, Berlin, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.