The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Apr. 29, 2009
Applicants:
Hyun-soo Chung, Gyeonggi-do, KR;
Seung-kwan Ryu, Gyeonggi-do, KR;
Ju-il Choi, Gyeonggi-do, KR;
Dong-ho Lee, Gyeonggi-do, KR;
Seong-deok Hwang, Seoul, KR;
Inventors:
Hyun-Soo Chung, Gyeonggi-do, KR;
Seung-Kwan Ryu, Gyeonggi-do, KR;
Ju-Il Choi, Gyeonggi-do, KR;
Dong-Ho Lee, Gyeonggi-do, KR;
Seong-Deok Hwang, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.