The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Nov. 29, 2006
Applicant:
Hideyo Osanai, Shiojiri, JP;
Inventor:
Hideyo Osanai, Shiojiri, JP;
Assignee:
Dowa Metaltech Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic part mounting substrate has a ceramic substrate, a metal member bonded to one side of the ceramic substrate, a metal plate of aluminum or an aluminum alloy, one side of the metal plate being bonded directly to the other side of the ceramic substrate, and an electronic part bonded directly to the other side of the metal plate.