The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Nov. 24, 2009
Jeffrey Drue David, San Jose, CA (US);
Harry Q. Lee, Los Altos, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Dominic J. Benvegnu, La Honda, CA (US);
Zhize Zhu, Cupertino, CA (US);
Wen-chiang Tu, Mountain View, CA (US);
Jeffrey Drue David, San Jose, CA (US);
Harry Q. Lee, Los Altos, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Dominic J. Benvegnu, La Honda, CA (US);
Zhize Zhu, Cupertino, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of a second set of parameters based on the difference, and polishing the substrate on a second platen using the adjusted parameter.