The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2011

Filed:

Aug. 31, 2006
Applicants:

Hua Fang, San Jose, CA (US);

John Chen, Cupertino, CA (US);

Inventors:

Hua Fang, San Jose, CA (US);

John Chen, Cupertino, CA (US);

Assignee:

PDF Solutions, Inc., San Jose, unknown;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 29/44 (2006.01); G11C 29/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for predicting an impact on post-repair yield resulting from manufacturing process modification is described. The method includes receiving bit data representing locations of defective memory cells for a plurality of memory devices. The bit data is modified by removing a selected failure pattern type according to a modification scheme to generate modified bit data. Repairs are simulated on hypothetical memory devices corresponding to the modified bit data, generating a result indicating whether the hypothetical memory device is good or bad. A post-repair yield is then identified and a report is generated indicating the post-repair yield, the post-repair yield representing a number of the plurality of memory devices that would be functional after repair had the plurality of memory devices been manufactured without the selected failure pattern. A method to identify a process providing the best economic benefit is also described.


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