The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
May. 26, 2005
Tomonori Shinoda, Saitama, JP;
Osamu Yamazaki, Saitama, JP;
Tomonori Shinoda, Saitama, JP;
Osamu Yamazaki, Saitama, JP;
Lintec Corporation, Tokyo, JP;
Abstract
A semiconductor sealing resin sheet is composed of a supporting sheet and a sealing resin layer releasably laminated on the supporting sheet, wherein the sealing resin layer has a thermosetting property, the elastic modulus of the sealing resin layer before thermosetting is 1.0×10to 1.0×10Pa, the melt viscosity 120° C. of the sealing resin layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the sealing resin layer before thermosetting is kept at a constant temperature of 120° C. A method for manufacturing semiconductor devices includes the steps of preparing a circuit substrate with a semiconductor chip mounted thereon, the circuit substrate is heated, the surface of the sealing resin layer in the semiconductor sealing resin sheet described above is embedded in concavo-convex parts and gaps on the semiconductor-chip-mounted surface of the circuit substrate, and the surface of the sealing resin layer is brought into contact with the surface of the circuit substrate and then the sealing resin layer is thermally cured.