The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
May. 24, 2007
Nobuhiko Kurata, Yokohama, JP;
Kouichirou Inoue, Yokosuka, JP;
Shinji Fujii, Yokohama, JP;
Muneaki Maeno, Yokohama, JP;
Nobuhiko Kurata, Yokohama, JP;
Kouichirou Inoue, Yokosuka, JP;
Shinji Fujii, Yokohama, JP;
Muneaki Maeno, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A third interconnection layer is disposed near a first interconnection layer and a second interconnection layer disposed above the first interconnection layer. The first interconnection layer and second interconnection layer are connected to each other by a regular via plug and a via plug for redundancy. The via plug for redundancy is disposed by the side of the regular via plug and between the regular via plug and the third interconnection layer. An extended portion of the second interconnection layer is extended from a portion connected to the via plug for redundancy on the second interconnection layer toward the third interconnection layer. The extended portion has a dimension smaller than the minimum dimension prescribed in the interconnection line design rule.