The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Apr. 28, 2009
Kai-ling Chiu, Pingtung County, TW;
Victor Chiang Liang, Hsinchu, TW;
Chih-yu Tseng, Hsinchu, TW;
Hui-sheng Chang, Kinmen County, TW;
Chia-te Chien, Keelung, TW;
You-ren Liu, Kaohsiung, TW;
Kai-Ling Chiu, Pingtung County, TW;
Victor Chiang Liang, Hsinchu, TW;
Chih-Yu Tseng, Hsinchu, TW;
Hui-Sheng Chang, Kinmen County, TW;
Chia-Te Chien, Keelung, TW;
You-Ren Liu, Kaohsiung, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A capacitor structure is provided. The capacitor structure comprises a plurality of parallel conductive line levels and a plurality of vias. Each conductive line level comprises first conductive lines parallel to each other and second conductive lines parallel to each other. Also, the first conductive lines on different conductive line levels are aligned to each other and the second conductive lines on different conductive line levels are aligned to each other so as to form first conductive line co-planes and second conductive line co-planes. The vias are located on the conductive line co-planes and between the conductive line levels for connecting the conductive lines on the neighboring conductive line levels. The vias, on a height level of each of the conductive line co-planes, are arranged only on one of the neighboring conductive line co-planes.