The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Aug. 03, 2007
Shinichi Maeda, Chiba, JP;
Go Ono, Chiba, JP;
Issei Okada, Osaka, JP;
Kohei Shimoda, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Nissan Chemical Industries, Ltd., Tokyo, JP;
Abstract
An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200° C. or lower which has no influence on the above-mentioned plastic substrate. The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200° C. or lower to form an insulating layerhaving a contact angle with water of 80° or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layerand heating the above-mentioned coating film at a temperature of 200° C. or lower to form a conductive layer such as a source layeror a drain layer