The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2011

Filed:

Nov. 13, 2006
Applicants:

Hideki Hirotsuru, Omuta, JP;

Goh Iwamoto, Omuta, JP;

Hideo Tsukamoto, Omuta, JP;

Akira Miyai, Omuta, JP;

Yoshio Sasaki, Omuta, JP;

Inventors:

Hideki Hirotsuru, Omuta, JP;

Goh Iwamoto, Omuta, JP;

Hideo Tsukamoto, Omuta, JP;

Akira Miyai, Omuta, JP;

Yoshio Sasaki, Omuta, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An aluminum-silicon carbide composite suitable for a base plate for power module, having an aluminum-silicon carbide composite, with a front and a rear surface plane, that is a flat plate-shaped silicon carbide porous body impregnated with a metal mainly containing aluminum, and an aluminum layer made of a metal mainly containing aluminum formed only on the front surface plane, wherein the rear surface plane of the composite is exposed to the outside, and the shape of the exposed aluminum-silicon carbide composite is rectangular, optionally having peripheral portions encompassing holes removed. Plating is imparted to the composite by providing an aluminum layer on the rear surface plane. Flatness of the composite is improved by grinding its rear surface so that the composite is exposed to the outside. Warpage after grinding the rear surface, is controlled by controlling the thickness of the aluminum layer.


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