The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2011

Filed:

Nov. 20, 2006
Applicants:

Shinji Kikuhara, Itami, JP;

Hitoshi Inoue, Itami, JP;

Noboru Uenishi, Itami, JP;

Satoshi Umemoto, Itami, JP;

Inventors:

Shinji Kikuhara, Itami, JP;

Hitoshi Inoue, Itami, JP;

Noboru Uenishi, Itami, JP;

Satoshi Umemoto, Itami, JP;

Assignee:

A.L.M.T. Corp., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/06 (2006.01); C22C 27/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are an ancillary material, used for shape processing, which is capable of shortening a processing time, avoiding a reduction in quality of a shape provided to a workpiece material, and allowing a relatively low manufacturing cost; a processing method using the ancillary material; and a method of manufacturing the ancillary material. The tungsten alloy grains () comprise: tungsten of greater than or equal to 80% by mass and less than or equal to 98% by mass; nickel; at least one kind of metal selected from the group consisting of iron, copper, and cobalt; and an inevitable impurity, a maximum diameter thereof is greater than or equal to 0.1 mm and less than or equal to 5.00 mm, and a specific surface area thereof is less than or equal to 0.02 m/g. The tungsten alloy grains (), the workpiece material (), an abrasive () are blended in a container () and the container is rotated, thereby processing the shape of the workpiece material (). In the method of manufacturing the tungsten alloy grains (), a granulated powder is stirred at a temperature greater than or equal to a softening point of an organic binder and thereafter, is cooled, thereby spheroidizing the granulated powder.


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