The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8022311 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 20, 2011

Filed:

Apr. 30, 2007
Applicants:

Tae Eui Kim, Seoul, KR;

Byoung Youl Min, Gyunggi-do, KR;

Myung Sam Kang, Gyunggi-do, KR;

Je Gwang Yoo, Gyunggi-do, KR;

Inventors:

Tae Eui Kim, Seoul, KR;

Byoung Youl Min, Gyunggi-do, KR;

Myung Sam Kang, Gyunggi-do, KR;

Je Gwang Yoo, Gyunggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.


Find Patent Forward Citations

Kim, Tae. (2011). Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same (U.S. Patent No. 8022311). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8022311

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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