The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2011

Filed:

Jan. 08, 2010
Applicants:

Seon Goo Lee, Gyunggi-Do, KR;

Kyung Taeg Han, Gyunggi-Do, KR;

Seong Yeon Han, Gwangjoo, KR;

Inventors:

Seon Goo Lee, Gyunggi-Do, KR;

Kyung Taeg Han, Gyunggi-Do, KR;

Seong Yeon Han, Gwangjoo, KR;

Assignee:

Samsung LED Co., Ltd., Gyunggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Published as:
KR100723247B1; US2007158669A1; JP2007189225A; US2010109040A1; US2010112735A1; US7714342B2; US7795052B2; US2010289051A1; JP2011029665A; US8013352B2; JP4791381B2; US8324646B2; JP2013012753A; JP5505745B2; JP5698496B2;

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