The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Jul. 09, 2004
Takeshi Takaha, Hyogo, JP;
Kazutoshi Fujii, Osaka, JP;
Takashi Kuriki, Osaka, JP;
Kenichi Kudo, Nara, JP;
Mamoru Wada, Nara, JP;
Michihiro Sunako, Nara, JP;
Junichi Takahara, Nara, JP;
Takeshi Takaha, Hyogo, JP;
Kazutoshi Fujii, Osaka, JP;
Takashi Kuriki, Osaka, JP;
Kenichi Kudo, Nara, JP;
Mamoru Wada, Nara, JP;
Michihiro Sunako, Nara, JP;
Junichi Takahara, Nara, JP;
Ezaki Glico Co., Ltd., Osaka, JP;
Sanwa Cornstarch Co., Ltd., Nara, JP;
Abstract
The present application discloses a molded article, and a process for preparing a molded article consisting essentially of (i) high molecular weight linear α-1,4-glucan and (ii) low molecular weight linear α-1,4-glucan, wherein the process comprises the step of: adding the low molecular weight linear α-1,4-glucan to a solution comprising the high molecular weight linear α-1,4-glucan to gel the solution, wherein the low molecular weight linear α-1,4-glucan has a degree of polymerization of greater than or equal to 180 and less than 620, and has a molecular weight distribution of not greater than 1.25 and, the high molecular weight linear α-1,4-glucan has a degree of polymerization of greater than or equal to 620 and less than 37000, and has a molecular weight distribution of not greater than 1.25.