The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Feb. 15, 2008
Applicants:
Takeshi Ishiguro, Fukushima-ken, JP;
Kenji Sugiura, Kawasaki, JP;
Hugh J. Griffin, Newtownabbey, GB;
Inventors:
Takeshi Ishiguro, Fukushima-ken, JP;
Kenji Sugiura, Kawasaki, JP;
Hugh J. Griffin, Newtownabbey, GB;
Assignee:
Icemos Technology Ltd., Belfast, Northern Ireland, GB;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/46 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first orientation is formed in the at least one die. At least one second trench having a second orientation that is different from the first orientation is formed in the at least one die.