The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2011
Filed:
Apr. 06, 2010
Soo Hyun Kim, Seoul, KR;
Baek Mann Kim, Kyoungki-do, KR;
Young Jin Lee, Kyoungki-do, KR;
Dong Ha Jung, Kyoungki-do, KR;
Jeong Tae Kim, Kyoungki-do, KR;
Soo Hyun Kim, Seoul, KR;
Baek Mann Kim, Kyoungki-do, KR;
Young Jin Lee, Kyoungki-do, KR;
Dong Ha Jung, Kyoungki-do, KR;
Jeong Tae Kim, Kyoungki-do, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
A multi-layer metal wiring of a semiconductor device and a method for forming the same are disclosed. The multi-layer metal wiring of the semiconductor device includes a lower Cu wiring, and an upper Al wiring formed to be contacted with the lower Cu wiring, and a diffusion barrier layer interposed between the lower Cu wiring and the upper Al wiring. The diffusion barrier layer is formed of a W-based layer.