The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8008186 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 30, 2011

Filed:

Mar. 08, 2010
Applicants:

Kazumichi Tsumura, Kanagawa, JP;

Masaki Yamada, Saitama, JP;

Inventors:

Kazumichi Tsumura, Kanagawa, JP;

Masaki Yamada, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device according to an embodiment of the present invention includes a semiconductor substrate; a wiring formed in predetermined pattern above the semiconductor substrate, a first insulating film lying right under the wiring, and a second insulating film lying in a peripheral portion other than a portion right under the wiring, in which a surface layer of the first insulating film lying in a boundary surface between the first insulating film and the second insulating film is chemically modified to reinforce the surface layer.


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Tsumura, Kazumichi. (2011). Semiconductor device and method of fabricating the same (U.S. Patent No. 8008186). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8008186

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