The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8008160 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 30, 2011

Filed:

Jan. 21, 2008
Applicants:

Kangguo Cheng, Guilderland, NY (US);

Xi LI, Somers, NY (US);

Richard Wise, Newburgh, NY (US);

Inventors:

Kangguo Cheng, Guilderland, NY (US);

Xi Li, Somers, NY (US);

Richard Wise, Newburgh, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a trench device structure having a single-side buried strap is provided. The method includes forming a deep trench in a semiconductor substrate, said deep trench having a first side portion and a second side portion; depositing a node dielectric on said deep trench, wherein said node dielectric covers said first side portion and said second side portion; depositing a first conductive layer over said node dielectric; performing an ion implantation or ion bombardment at an angle into a portion of said node dielectric, thereby removing said portion of said node dielectric from said first side portion of said deep trench; and depositing a second conductive layer over said first conductive layer, wherein said second conductive layer outdiffuses into a portion of said semiconductor substrate. A trench device structure having a single-side buried strap is also provided. The device structure includes a semiconductor substrate having a deep trench therein; and a first conductive layer and a second conductive layer sequentially disposed on said deep trench, wherein said second conductive layer outdiffuses into a portion of said semiconductor substrate.


Find Patent Forward Citations

Cheng, Kangguo. (2011). Method and structure for forming trench dram with asymmetric strap (U.S. Patent No. 8008160). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8008160

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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