The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2011

Filed:

Jan. 08, 2009
Applicants:

Gregory M. Chrysler, Chandler, AZ (US);

James G. Maveety, San Jose, CA (US);

Inventors:

Gregory M. Chrysler, Chandler, AZ (US);

James G. Maveety, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28F 7/00 (2006.01); H05K 7/20 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area.


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