The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
May. 29, 2007
Varughese Mathew, Austin, TX (US);
Eddie Acosta, Martindale, TX (US);
Ritwik Chatterjee, Austin, TX (US);
Sam S. Garcia, Austin, TX (US);
Varughese Mathew, Austin, TX (US);
Eddie Acosta, Martindale, TX (US);
Ritwik Chatterjee, Austin, TX (US);
Sam S. Garcia, Austin, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method for forming an interconnect, comprising (a) providing a substrate () with a via () defined therein; (b) forming a seed layer () such that a first portion of the seed layer extends over a surface of the via, and a second portion of the seed layer extends over a portion of the substrate; (c) removing the second portion of the seed layer; and (d) depositing a metal () over the first portion of the seed layer by an electroless process.