The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Jan. 24, 2006
Jianfeng Luo, Fremont, CA (US);
Subarnarekha Sinha, Foster City, CA (US);
Qing Su, Sunnyvale, CA (US);
Charles C. Chiang, San Jose, CA (US);
Jianfeng Luo, Fremont, CA (US);
Subarnarekha Sinha, Foster City, CA (US);
Qing Su, Sunnyvale, CA (US);
Charles C. Chiang, San Jose, CA (US);
Synopsys, Inc., Mountain View, CA (US);
Abstract
One embodiment of the present invention provides a system that predicts manufacturing yield for a die within a semiconductor wafer. During operation, the system first receives a physical layout of the die. Next, the system partitions the die into an array of tiles. The system then computes systematic variations for a quality indicative value to describe a process parameter across the array of tiles based on the physical layout of the die. Next, the system applies a random variation for the quality indicative parameter to each tile in the array of tiles. Finally, the system obtains the manufacturing yield for the die based on both the systematic variations and the random variations.