The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Dec. 27, 2007
Guo-cheng Liao, Kaohsiung, TW;
Guo-Cheng Liao, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A via hole structure and a manufacturing method thereof are provided. The via hole structure is disposed on a substrate. The substrate has a through hole, which passes through the substrate from a top surface to a bottom surface. The via hole structure comprises a conductive layer, several first conductive lines and several second conductive lines. The conductive layer having several conductive sections is disposed on the inner wall of the through hole. The first conductive lines are adjacent to the top surface for connecting the top ends of the conductive sections. The second conductive lines are adjacent to the bottom surface for connecting the bottom ends of the conductive sections. The conductive sections, the first conductive lines and the second conductive lines are serially connected to form a three-dimension layout.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile