The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Feb. 11, 2008
Edward M. Demulder, Essex Junction, VT (US);
Sarah H. Knickerbocker, Hopewell Junction, NY (US);
Michael J. Shapiro, Austin, TX (US);
Albert M. Young, Fishkill, NY (US);
Edward M. DeMulder, Essex Junction, VT (US);
Sarah H. Knickerbocker, Hopewell Junction, NY (US);
Michael J. Shapiro, Austin, TX (US);
Albert M. Young, Fishkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The process begins with separate device wafers having complimentary chips. Thin metal capture pads, having a preferred thickness of about 10 microns so that substantial pressure may be applied during processing without damaging capture pads, are deposited on both device wafers, which are then tested and mapped for good chip sites. A handle wafer is attached to one device wafer, which can then be thinned to improve via etching and filling. Capture pads are removed and replaced after thinning. The device wafer with handle wafer is diced, and good chips with attached portions of the diced handle wafer are positioned and bonded to the good chip sites of the other device wafer, and the handle wafer portions are removed. The device wafer having known good 3-D chips then undergoes final processing.