The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

Oct. 03, 2008
Applicants:

Tomoaki Kudaishi, Tokyo, JP;

Satoshi Sakurai, Tokyo, JP;

Takayuki Tsutsui, Tokyo, JP;

Masashi Yamaura, Tokyo, JP;

Reiichi Arai, Tokyo, JP;

Takayuki Maehara, Tokyo, JP;

Inventors:

Tomoaki Kudaishi, Tokyo, JP;

Satoshi Sakurai, Tokyo, JP;

Takayuki Tsutsui, Tokyo, JP;

Masashi Yamaura, Tokyo, JP;

Reiichi Arai, Tokyo, JP;

Takayuki Maehara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention aims to reduce an exclusively-possessed area of each of bonding wires mounted over a wiring board, for coupling a power amplifying unit of a semiconductor chip and an antenna switch of a second semiconductor chip in a semiconductor device that configures an RF module. In the RF module, the first semiconductor chip and the second semiconductor chip are mounted side by side in a central area of the wiring board. The first semiconductor chip is formed with amplifier circuits and a control circuit and comprises a silicon substrate or a compound semiconductor substrate. On the other hand, the second semiconductor chip is formed with an antenna switch and comprises the silicon substrate or compound semiconductor substrate. Pads of the first semiconductor chip and pads of the second semiconductor chip are respectively electrically coupled to one another. This coupling is carried out by the bonding wires formed in the surface of the wiring board and the bonding wires formed inside the wiring board.


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