The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

Dec. 09, 2005
Applicants:

Erik C. Wasinger, Naperville, IL (US);

Gary C. Ettinger, Cupertino, CA (US);

Sen-hou Ko, Sunnyvale, CA (US);

Wei-yung Hsu, Santa Clara, CA (US);

Liang-yuh Chen, Foster City, CA (US);

Ho Seon Shin, Cupertino, CA (US);

Donald Olgado, Palo Alto, CA (US);

Inventors:

Erik C. Wasinger, Naperville, IL (US);

Gary C. Ettinger, Cupertino, CA (US);

Sen-Hou Ko, Sunnyvale, CA (US);

Wei-Yung Hsu, Santa Clara, CA (US);

Liang-Yuh Chen, Foster City, CA (US);

Ho Seon Shin, Cupertino, CA (US);

Donald Olgado, Palo Alto, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); H01I 21/306 (2006.01);
U.S. Cl.
CPC ...
Abstract

Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.


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