The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Jan. 18, 2008
Cheng-chang Lee, Taoyuan Hsien, TW;
Horng-jou Wang, Taoyuan Hsien, TW;
Zong-ting Yuan, Taoyuan Hsien, TW;
Chao-jui Liang, Taoyuan Hsien, TW;
Hsieh-shen Hsieh, Taoyuan Hsien, TW;
Huang-kun Chen, Taoyuan Hsien, TW;
Tai-kang Shing, Taoyuan Hsien, TW;
Cheng-Chang Lee, Taoyuan Hsien, TW;
Horng-Jou Wang, Taoyuan Hsien, TW;
Zong-Ting Yuan, Taoyuan Hsien, TW;
Chao-Jui Liang, Taoyuan Hsien, TW;
Hsieh-Shen Hsieh, Taoyuan Hsien, TW;
Huang-Kun Chen, Taoyuan Hsien, TW;
Tai-Kang Shing, Taoyuan Hsien, TW;
Delta Electronics Inc., Kuel San, Taoyuan Hsien, TW;
Abstract
A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.