The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2011

Filed:

Nov. 26, 2008
Applicants:

Biljana Mikijelj, Cerritos, CA (US);

Shanghua Wu, Irvine, CA (US);

Inventors:

Biljana Mikijelj, Cerritos, CA (US);

Shanghua Wu, Irvine, CA (US);

Assignee:

Ceradyne, Inc., Costa Mesa, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/575 (2006.01); C04B 35/565 (2006.01);
U.S. Cl.
CPC ...
Abstract

A dense silicon carbide (SiC) material with boron (B), nitrogen (N) and oxygen (O) as the only additives and with excellent insulting performance (electrical volume resistivity greater than 1×10Ω·cm). The SiC ceramic material, made from a powder mix of, by weight, from 0.1 to 7% boron carbide, from 0.1 to 7% silicon nitride, from 0.1 to 6% silicon dioxide, and a balance of α-SiC, consists essentially of (1) at least 90% by weight of α-SiC, (2) about 0.3 to 4.0% by weight of boron, (3) about 0.1 to 6.0% by weight of nitrogen, (4) about 0.06 to 0.5% by weight of oxygen, and (5) no more than 0.07% by weight of metallic impurities; wherein the boron and nitrogen are present according to an B/N atomic ratio of 0.9 to 1.5. In particular, this material is suitable for applications in plasma etching chambers for semiconductor and integrated circuit manufacturing.


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