The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Dec. 05, 2007
Masayuki Kiso, Hirakata, JP;
Yoshikazu Saijo, Hirakata, JP;
Tohru Kamitamari, Hirakata, JP;
C. Uyemura & Co., Ltd., Osaka-shi, JP;
Abstract
An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R—NH—CH—NH—Ror (CH—NH—CH—NH—CH)—R(wherein Rto Rrepresent —OH, —CH, —CHOH, —CHOH, —CHN(CH), —CHNH(CHOH), —CHNH(CHOH), —CHNH(CHOH), —CHNH(CHOH), —CHN(CHOH), —CHN(CHOH), —CHN(CHOH)or —CHN(CHOH), and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.