The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2011

Filed:

Oct. 11, 2007
Applicants:

Kensuke Nishi, Ibaraki, JP;

Akinori Itokawa, Ibaraki, JP;

Visit Thaveeprungsriporn, Ibaraki, JP;

Inventors:

Kensuke Nishi, Ibaraki, JP;

Akinori Itokawa, Ibaraki, JP;

Visit Thaveeprungsriporn, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A base material in which a base insulating layer and a metallic layer are laminated is prepared. The metallic layer is processed into a predetermined pattern to form conductor patterns including terminal parts. A hole is formed in a region under a predetermined terminal part where the base insulating layer is formed by directing a laser beam from below. A reinforcing board having a through hole is attached to the lower surface of the base insulating layer by a sheet-like adhesive having a through hole, with the holes being aligned with one another. An opening space formed by the holes is filled with metallic paste by screen printing. In this way, a printed circuit board is fabricated. An electronic component is mounted on this printed circuit board.


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