The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Nov. 09, 2010
Masafumi Horio, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Eiji Mochizuki, Matsumoto, JP;
Rikihiro Maruyama, Matsumoto, JP;
Masafumi Horio, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Eiji Mochizuki, Matsumoto, JP;
Rikihiro Maruyama, Matsumoto, JP;
Fuji Electric Device Technology Co., Ltd., Tokyo, JP;
Abstract
A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, and the semiconductor device; pouring a resin in a paste form into the case to fill a space relative to the first metal foil, insulating sheet, the second metal foil and the semiconductor device; and heat-curing the resin. A bottom end of a peripheral wall of the case is located above a bottom surface of the first metal. The bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.