The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2011

Filed:

Mar. 20, 2007
Applicants:

Takao Gotoh, Mie-ken, JP;

Akifumi Hayashi, Kuwana, JP;

Tohru Matsuoka, Mie-ken, JP;

Shigehiro Suzuki, Kuwana, JP;

Yoshiyuki Furukawa, Kaizu, JP;

Makoto Tanaka, Yokkaichi, JP;

Inventors:

Takao Gotoh, Mie-ken, JP;

Akifumi Hayashi, Kuwana, JP;

Tohru Matsuoka, Mie-ken, JP;

Shigehiro Suzuki, Kuwana, JP;

Yoshiyuki Furukawa, Kaizu, JP;

Makoto Tanaka, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05D 7/06 (2006.01); G01F 1/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for calibrating a mass flow controller comprising a calibrating valve disposed on the most upstream side of a path, a mass flow rate control valve mechanism, a tank provided at the path on the upstream side of the mass flow rate control valve mechanism, a mass-flow-rate-sensing means, a pressure-sensing means, a means for controlling the mass flow rate control valve mechanism, and a mass flow rate calibration control means, the method comprising the steps of (1) permitting a fluid at a set mass flow rate to flow through the path, (2) setting the mass flow rate control valve mechanism at a degree of opening that the mass flow rate of the fluid is equal to the set mass flow rate, (3) closing the calibrating valve, (4) measuring the pressure and mass flow rate of the fluid after a fluid flow from the tank is stabilized, (5) determining a variation ratio of the pressure and mass flow rate to reference pressure and mass flow rate measured by the same procedures in an initial state, and (6) performing calibration depending on the variation ratio.


Find Patent Forward Citations

Quick Actions:

Gotoh, Takao. (2011). Mass flow rate control apparatus, its calibration method and semiconductor-producing apparatus (U.S. Patent No. 7979165). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7979165

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…