The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2011

Filed:

Aug. 16, 2010
Applicants:

Katsumi Mori, Sakata, JP;

Kei Kawahara, Isahaya, JP;

Yoshikazu Kasuya, Sakata, JP;

Inventors:

Katsumi Mori, Sakata, JP;

Kei Kawahara, Isahaya, JP;

Yoshikazu Kasuya, Sakata, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 27/088 (2006.01); H01L 31/00 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device has first wiring layersand a plurality of dummy wiring layersthat are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines Lextending in a direction traversing the row direction. The row direction and the first virtual linear lines Ldefine an angle of 2-40 degrees, and the dummy wiring layersare disposed in a manner to be located on the first virtual linear lines L. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines Lextending in a direction traversing the column direction. The column direction and the second virtual linear lines Ldefine an angle of 2-40 degrees, and the dummy wiring layersare disposed in a manner to be located on the second virtual linear lines L


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