The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Nov. 17, 2008
Chau Fatt Chiang, Melaka, MY;
Hsieh Ting Kuek, Melaka, MY;
Chau Fatt Chiang, Melaka, MY;
Hsieh Ting Kuek, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing a semiconductor package includes providing a carrier, forming a post slot and a terminal slot in the carrier, depositing a post in the post slot, depositing a terminal in the terminal slot, forming an encapsulant slot in the carrier, wherein the post extends into and is located within a periphery of the encapsulant slot and the terminal extends into the encapsulant slot, mechanically attaching a semiconductor chip to the post, electrically connecting the chip to the terminal, depositing an encapsulant in the encapsulant slot, and removing the carrier from the terminal.