The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Dec. 23, 2008
Seiji Fujiwara, Kyoto, JP;
Yoshihiro Tomita, Osaka, JP;
Akio Furusawa, Osaka, JP;
Kenichirou Suetugu, Hyogo, JP;
Seiji Fujiwara, Kyoto, JP;
Yoshihiro Tomita, Osaka, JP;
Akio Furusawa, Osaka, JP;
Kenichirou Suetugu, Hyogo, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In a semiconductor device bonded to a motherboard with a bonding material having a melting point of 200° C. to 230° C., a bonding materialwhich is a die bonding material for bonding a semiconductor elementto a semiconductor substrateis a Bi alloy containing 0.8 wt % to 10 wt % of Cu and 0.02 wt % to 0.2 wt % of Ge, so that the bonding materialfor bonding the semiconductor elementto the semiconductor substrateis not melted when the semiconductor device is bonded to the motherboard by reflowing. It is therefore possible to suppress poor connection on the semiconductor element, thereby securing the mountability and electrical reliability of the semiconductor device.