The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2011

Filed:

Jul. 12, 2009
Applicants:

Xiao-feng MA, Shenzhen, CN;

Lei Liu, Shenzhen, CN;

Chia-shin Chou, Taipei Hsien, TW;

Inventors:

Xiao-Feng Ma, Shenzhen, CN;

Lei Liu, Shenzhen, CN;

Chia-Shin Chou, Taipei Hsien, TW;

Assignees:

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G01R 31/26 (2006.01); G01K 7/02 (2006.01); G01K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol.


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