The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2011

Filed:

Jan. 07, 2009
Applicants:

Mitsuhisa Watanabe, Tokyo, JP;

Ichiro Anjoh, Tokyo, JP;

Inventors:

Mitsuhisa Watanabe, Tokyo, JP;

Ichiro Anjoh, Tokyo, JP;

Assignee:

Elpida Memory, Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

Semiconductor deviceincludes: first wiring boardprovided with a plurality of external terminalson the under surface thereof; first semiconductor chipwith the under surface thereof mounted on the upper surface of first wiring board; and second semiconductor chipwith the under surface thereof mounted on the upper surface of first semiconductor chip. On the upper surface of first wiring board, connecting padand connecting padare provided, while connecting padis electrically connected with the under surface of first semiconductor chipand connecting padis arranged closely to an end portion of first semiconductor chip. Connecting padand connecting padare electrically connected with external terminals. Semiconductor devicefurther includes: connecting padprovided as contacting or as being close to an upper end portion of second semiconductor chipwhile being electrically connected with the upper surface of second semiconductor chip, and wirewhich electrically connects connecting padand connecting pad


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