The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Oct. 25, 2007
Lin-yin Wong, Hsinchu, TW;
Mao-hua Yeh, Hsinchu, TW;
Wang-hsiang Tsai, Hsinchu, TW;
Unimicron Technology Corp., , TW;
Abstract
A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.