The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2011

Filed:

Apr. 29, 2008
Applicants:

Takahisa Yoshioka, Tokyo, JP;

Yoshiaki Sugishita, Tokyo, JP;

Inventors:

Takahisa Yoshioka, Tokyo, JP;

Yoshiaki Sugishita, Tokyo, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B32B 37/12 (2006.01); B32B 38/10 (2006.01); B32B 39/00 (2006.01); B32B 37/14 (2006.01); B32B 37/26 (2006.01); B31F 5/06 (2006.01); B32B 37/10 (2006.01); B65H 29/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A transferring devicefor transferring plate-like members such as a semiconductor wafer and the like among the first table T, the second table Tand the third table T. The transferring deviceincludes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robotfor transferring the supporting unit. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table Tthrough Tcan be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.


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