The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Dec. 21, 2005
Yoshiyuki Wada, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Yoshiyuki Wada, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In order to mount an electronic component, a connection terminal of the electronic component is bonded to electrodes of a substrate. This is done by using solder paste which mixes solder particles in a thermosetting adhesive. The solder paste is supplied to the electrodes and a recess. Solder print parts are formed. The electronic component is mounted and the connection terminal and the main body of the electronic component are adhered to the solder print parts, and are heated in this state by reflow. As a result, the connection terminal and the electrodes are bonded by a solder junction.