The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
May. 11, 2009
Thomas Dyer Bonifield, Dallas, TX (US);
Thomas W. Winter, McKinney, TX (US);
William R. Morrison, Dallas, TX (US);
Gregory D. Winterton, Flower Mound, TX (US);
Asad M. Haider, Plano, TX (US);
Thomas Dyer Bonifield, Dallas, TX (US);
Thomas W. Winter, McKinney, TX (US);
William R. Morrison, Dallas, TX (US);
Gregory D. Winterton, Flower Mound, TX (US);
Asad M. Haider, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A TSV-MEMS packaging process is provided. The process includes forming TSVs in the front side of the product wafer, and attaching a first carrier to the front side of the product wafer, subsequent to forming TSVs. The process further includes thinning the back side of the product wafer to expose TSV tips, detaching the first carrier from the front side of the product wafer, and transferring the thinned wafer to a second carrier with back side adhered to the second wafer carrier. Semiconductor components are added to the front side of the product wafer, followed by forming a hermetic cavity over the added semiconductor components, and detaching the second carrier from the back side of the product wafer. Wafer level processing continues after detaching the second carrier.