The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Apr. 09, 2009
August J. Miller, Jr., Queen Creek, AZ (US);
Jeffrey A. Miks, Chandler, AZ (US);
Christopher M. Scanlan, Hellerup, DK;
Mahmoud Dreiza, Phoenix, AZ (US);
August J. Miller, Jr., Queen Creek, AZ (US);
Jeffrey A. Miks, Chandler, AZ (US);
Christopher M. Scanlan, Hellerup, DK;
Mahmoud Dreiza, Phoenix, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.