The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2011
Filed:
Dec. 12, 2008
Michael D. Gruenhagen, Salt Lake City, UT (US);
Suku Kim, South Jordan, UT (US);
James J. Murphy, South Jordan, UT (US);
Eddy Tjhia, Sunnyvale, CA (US);
Chung-lin Wu, San Jose, CA (US);
Mark Larsen, Sandy, UT (US);
Douglas E. Dolan, York, ME (US);
Michael D. Gruenhagen, Salt Lake City, UT (US);
Suku Kim, South Jordan, UT (US);
James J. Murphy, South Jordan, UT (US);
Eddy Tjhia, Sunnyvale, CA (US);
Chung-Lin Wu, San Jose, CA (US);
Mark Larsen, Sandy, UT (US);
Douglas E. Dolan, York, ME (US);
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.