The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Sep. 28, 2007
Jay Sanford Burnham, Fletcher, VT (US);
Joseph Kerry Vaughn Comeau, Essex Junction, VT (US);
Leslie Peter Crane, Williston, VT (US);
James Randall Elliott, Richmond, VT (US);
Scott Alan Estes, Essex Junction, VT (US);
James Spiros Nakos, Essex Junction, VT (US);
Eric Jeffrey White, Charlotte, VT (US);
Jay Sanford Burnham, Fletcher, VT (US);
Joseph Kerry Vaughn Comeau, Essex Junction, VT (US);
Leslie Peter Crane, Williston, VT (US);
James Randall Elliott, Richmond, VT (US);
Scott Alan Estes, Essex Junction, VT (US);
James Spiros Nakos, Essex Junction, VT (US);
Eric Jeffrey White, Charlotte, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A computer system. The computer system including a processor and memory unit coupled to the processor, the memory unit containing instructions that when executed by the processor implement a method for monitoring a solution in a tank used to fabricate integrated circuits, the method comprising the computer implemented steps of: (a) collecting data indicating of an amount of copper in a region of a substrate of a monitor, the monitor comprising an N-type region in a silicon substrate, the region abutting a top surface of the substrate, the monitor having been submerged in the solution for a preset time; (b) comparing the data to a specification for copper content of the solution; (c) if the data indicates a copper content exceeds a limit of the specification for copper, indicating a corrective action is required to prevent copper contamination of the integrated circuits; and (d) repeating steps (a) through (c) periodically.