The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Nov. 12, 2008
Poh Leng Eu, Petaling Jaya, MY;
Boon Yew Low, Petaling Jaya, MY;
Wai Keong Wong, Shah Alam, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A mold () including a first mold part () and a second mold part () define a mold cavity () therebetween. A gate () is formed in at least one of the first and second mold parts () and () such that the gate () communicates with the mold cavity (). A vent () having a constricted portion () is arranged to communicate with the mold cavity (). A substrate () including a base substrate () and an electrically conductive pattern () and () formed on the base substrate () may be received in the mold (). A solder resist layer () is formed on the base substrate () and a portion of the electrically conductive pattern (). A plurality of grooves () and () is formed in a staggered arrangement around a periphery of a molding area () on the substrate ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile