The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Oct. 05, 2006
Applicants:
Hideaki Nonaka, Tokyo, JP;
Kenji Kobayashi, Tokyo, JP;
Yoshiaki Sugishita, Tokyo, JP;
Inventors:
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 65/10 (2006.01); B32B 37/00 (2006.01); B32B 38/04 (2006.01); B32B 38/10 (2006.01); B32B 41/00 (2006.01); B31F 5/00 (2006.01); G03D 15/04 (2006.01); B26D 5/00 (2006.01); B26D 1/14 (2006.01); B26D 1/18 (2006.01); B65C 9/40 (2006.01); G05G 15/00 (2006.01); B23D 33/02 (2006.01); B27B 5/00 (2006.01); B27B 5/18 (2006.01); B27B 27/06 (2006.01); B27B 5/34 (2006.01); B27B 3/28 (2006.01); B27B 27/04 (2006.01); A47G 29/00 (2006.01); F16M 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A sheet cutting tableafter sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet Swith a cutting deviceThe tableincludes an inner tablewhich supports the semiconductor wafer W, and an outer tablecorresponding to the unnecessary adhesive sheet Soutside the semiconductor wafer W. The upper surface of the outer tableis provided with a non-adherable treatment surfaceA, and an adherable member formed with a ring memberor a plate memberfor sticking the adhesive sheet S thereto.